IBM Solid Logic - Microphotographic comparison of SLT (Solid Logic Technology) for the IBM 360 and 370
International Business Machines Corporation. East Fishkill Components Division. (IBM)
10 x 8 in.
International Business Machines Corporation (IBM)
This is a microphotograph color image of four different round wafers and their respective chips. The wafers are arranged on the left side of the image in vertical column. The first wafer is labeled "SLT" (Solid Logic Technology). The second wafer is labeled "MST" (Monolithic Systems Technology). The third wafer is labeled "Phase 2i" (bipolar) large-scale integrated-circuit memory. The fourth is labeled "FET"(Field-Effect Transistor) Integrated circuit memory wafers, modules and chips, for the IBM 370. To the right of the wafer column is an individual chip cut out from the respective wafer. The last column is an exploded view of each chip. No magnification is available. The wafers and individual chips are displayed against the backdrop of an off white to tan surface. The exploded views showing the closeup circuits of each chip are from another source which were added to the original image. These separate images contain purple backgrounds. The light source on these items is coming from two different overhead directions as seen from the double shadows being cast on the chips. Verso side of image has written "#1402" in pencil on the top edge center. There is also 10 x 7 7/8 in. copy of a typed data sheet describing each of the wafers in more detail. The data sheet is dated 1974-11-26 and written in pencil on the top right corner is "#1402". Towards the middle of the sheet in pencil is "MST - Monolithic Systems Technology".