Artifact Details

Description

The object is described by donor as:
This strip of dual inline packages (DIPS) with gold plated leads illustrates a
new trend in packaging that began in the late 1960s, known as "flip-chip
packaging." The concept behind this package format was to eliminate the
traditional wire bonding that connected the chip to the package. In this
case, a precision metallized pattern was screen printed onto the white
ceramic substrate, so that the integrated circuit chip could be mounted face
down directly to the metallized traces. Bumps were created on the chip
bonding pads to match the tips of these traces, and create a compression
bond connection.

Identifying Numbers

Other number	17	Handwritten on paper label
Other number	IIBA	Printed on the bottom of the ceramic substrate
Other number	RL-14	Printed on the bottom of the ceramic substrate

Dimensions

overall: 3/8 in x 11 1/2 in x 3/8 in

Category

Component/module

Credit

Gift of SEMI

Lot Number

X4294.2008