Artifact Details

Description

#32 - Toward the end of the 1960s, some companies were experimenting with multichip array packages, which could act as memory modules. Box #32 of this lot contains many of these modules, which typically housed anywhere from 8 to 12 integrated circuit chips, mounted o n m fine line patterns, mostly in quad pak configurations with through-h61d,mounting into their printed circuit board. The metallization patterns on-these packages pushed the limits of screen printing technology to the point where etched thin film
circuits were often used to achieve super fine-line geometries.

Manufacturer

Fairchild Semiconductor Corporation

Identifying Numbers

Other number

32

Donor's key number.

Dimensions

overall: 1 1/2 in x 12 1/2 in x 9 3/4 in

Category

Component/Semiconductor/IC

Credit

Gift of SEMI

Lot Number

X4294.2008