Donor wrote, "By the early 1980s, the level of sophistication in packaging had reached incredible densities, as shown in this collection of high-pin-count modules from various suppliers. Of particular interest is the logic and processor packages from Intel, which dissipate so much heat that enormous copper heat sinks are required on the backside of the 244-pin ceramic package. Pin spacing has decreased to incredibly small dimensions, and every package in this collection shows leading edge technology."