Artifact Details

Title

Box of high pin count modules

Catalog Number

102688691

Type

Physical object

Identifying Numbers

Other number 19 Printed an IC.
Other number 24430660CD Printed an IC.
Other number 62 Donor identification number.
Other number A4 Printed an IC.

Dimensions

in box: 1 1/2 in x 7 in x 5 in

Description

Donor wrote, "By the early 1980s, the level of sophistication in packaging had reached incredible densities, as shown in this collection of high-pin-count modules from various suppliers. Of particular interest is the logic and processor packages from Intel, which dissipate so much heat that enormous copper heat sinks are required on the backside of the 244-pin ceramic package. Pin spacing has decreased to incredibly small dimensions, and every package in this collection shows leading edge technology."

Category

Component/module

Credit

Gift of SEMI

Lot Number

X4294.2008