Artifact Details

Title

Box of dual in-line packages

Catalog Number

102688692

Type

Physical object

Identifying Numbers

Other number 44 Donor identification number.

Dimensions

in box: 3/4 in x 7 1/8 in x 3 3/4 in

Description

Donor writes, "Following the successful development of silicone-molded dual inline packages by Signetics in the late 1960s, other companies began experimenting with cheaper epoxy-molded packages in the early 1970s, and this created a major transition away from ceramic packages, and into plastic dual inline packages. Following the earlier ceramic technology, these plastic DIP packages were often configured as pre-molded DIPS, containing die attach pads and gold plated leadframe tips. Eventually, other companies, led by National Semiconductor, began manufacturing epoxy molded dual inline packages as post-molded configurations in the early 1970s."

Category

Component/Semiconductor/other

Credit

Gift of SEMI

Lot Number

X4294.2008