TitleFlexible tape IC packaging
|Other number||59||Key number provided by the donor is lon a label on the box.|
Dimensionsin box: 1/4 in x 7 in x 5 in
DescriptionThe donor describes this object as follows:
"Not to be left out, manufacturers of flexible printed circuit tape began flooding the market with super-fine-line geometries, executed on reel-to-reel tape patterns, as shown in this collection from some 40 different suppliers. The reel-to-reel tape assembly process for packaging chips took a huge turn upward in the 1970s, when National Semiconductor launched its TAB (tape automated bonding) program with 3M Corporation, in developing a fully automated gang bonding process. Samples of this are shown in this collection."
There are 8 pieces in this accession number.