TitleHitachi High Density Module Board
PublisherHitachi Data Systems
|Other number||P3226||Verso ink|
Dimensionsoverall: 8 in x 10 in
DescriptionColor image of a Hitachi High Density Module Board.
Verso paper label: " The High Density Module (HDM) used int the newly announced Hitachhi Data Systems EX Series models 310 and 420, features 12,000 gate logic semiconductor components. Each HDM (pictured without the water cooling portion of the HDM) contains 36 such semiconductor devices. By placing the devices closer together, designers of the system achieve higher levels of performance. Water is used to dissipate heat in order to insure reliablilty. (Tech-HDM)"