Fritz-Werner Beyerlein worked for the semiconductor division of Siemens AG in Munich, Germany, and is named as inventor on patents related to semiconductor packaging techniques issued in Germany between 1964 and 1967. He joined Fairchild in early 1967 and was listed as head of the Packaging section of the Device Development Department managed by J. Kabell in a 1968 organization chart. He moved to Signetics Corporation, Sunnyvale, California, circa 1970 where he ran the packaging department with an emphasis on plastic molding technology. He was an early employee and worked at Cypress Semiconductor in San Jose and headed a new assembly plant in the Philippines in 1996.
One entry dated 1976-01-19 on page 1.
12 x 10 inches
Four notes on the “Redesign of CFB-diode-package- production”
The author is named as inventor on 6 U.S patents and 5 German patents. None are assigned to Fairchild.
Fairchild Semiconductor notebooks and technical papers