Artifact Details

Title

Blech patent notebook (#407)

Catalog Number

102722933

Type

Text

Date

1964-12-15

Author

Blech, Ilan Asriel

Biographical Notes

Illan A. Blech was born in Austria in 1936. He received a Ph.D. from Technicon-Israel Institute of Technology. He joined Fairchild in 1964 where he was a pioneer in understanding the mechanism of electromigration related to aluminum interconnects. With Gordon Moore he travelled to IBM to consult on electromigration issues with SLT modules for the IBM 360 project. A 1966 organization chart shows him as a Member of Technical Staff reporting to Harry Sello, manager of the Materials and Processes Dept. In 1968 he was manager of the Contact Technology Section. In the mid-1970s he was publishing papers from Bell Labs and from the Department of Electrical Engineering at Technicon. Blech was president of Flexus, Inc., Sunnyvale and is named as inventor patents assigned to Flexus, Tencor, Zoran, and Silicon Light Machines. Blech was the only professional colleague who agreed with Dan Shechtman’s discovery of quasicrystals at Technicon. In 1984 he deciphered Shechtman's experimental findings and offered an explanation, known as the Icosahedral Glass Model. Shechtman was awarded to Nobel Prize in Chemistry for this work in 2011.

Publisher

Fairchild Semiconductor

Identifying Numbers

Document number 407

Extent

No entries.

Dimensions

12 x 10 inches

Description

According to a title on page 1, Blech planned to use this book to record details of the Beam Lead Project but abandoned the volume without making an entry.

Patents

The author is named as inventor on 10 U.S patents. No patents are assigned to Fairchild.

Category

Notebooks

Collection Title

Fairchild Semiconductor notebooks and technical papers

Publications

The author contributed to the following R&D Technical Reports (TR) and conference papers during his service at Fairchild:

TR215 X-Ray extinction contrast topography of silicon strained by thin surface films (1965-06-14).

TR238 Some new aspects of gold-aluminum bonds (1966-04-25).

TR274 The failure of thin aluminum current carrying strips on oxidized silicon (1967-01-08).

TR277 Enhanced X-Ray diffraction from substrate crystals containing discontinuous surface films (1966-12-09).

TR294 Stacking fault contrast in X-Ray topographs of annealed si web dendrite (1967-03-22).

TR355 Electromigration in thin Al films (1968-08-19).

TR432 Electromigration in integrated circuits (1969-10-03).

Blech, I. A., Campbell, J. F., and Shepherd, W. H. Discontinuities in evaporated aluminum interconnections. 8th Annual Reliability Physics Symposium, (1970): 144-157.

Blech, I. A. and Meieran, E. S., Direct transmission electron microscope observation of electrotransport in aluminum thin films. Sixth Annual Reliability Physics Symposium, (1967): 147.

Blech, I. A. and Meieran, E. S., Erratum: electromigration in thin Al films. Journal of Applied Physics, vol. 43, iss. 2 (1972): 762.

Credit

Gift of Texas Instruments Incorporated

Lot Number

X6464.2012