Flip chip parity control module
Digital Equipment Corporation (DEC)
||Stamped in plastic holder on side 2.
||Printed in black near handle on side 1.
||Written in solder on side 2 on left edge.
||Stamped in white on plastic handle. Printed in solder on side 2.
overall: 8 7/8 in x 5 1/4 in x 1/2 in
This module consists of integrated circuits, resistors, capacitors, doides and LED. There are circuits on both sides. There are several inspection stamps on side 1.
Gift of Hewlett-Packard Company