Flip chip cntl and status regs module
Digital Equipment Corporation (DEC)
||Stamped into plastic of handle on side 2.
||Written in black on handle on top edge on side 1.
||Written in solder on side 2 near left edge.
||Printed in white on handle and solded on side 2 near handle.
overall: 8 7/8 in x 5 1/4 in x 1/2 in
This module consists of integrated circuits, capacitors and doides. There are circuits on both sides. There are several inspection stamps on side 1.
Gift of Hewlett-Packard Company