Artifact Details

Title

Wafer, 4 inch, diced

Catalog Number

102732896

Type

Physical object

Identifying Numbers

Other number DC 337 Written in ink on paper slip found with item
Other number X1770.2000A Written in ink on back of adhesive carrier
Other number Z305-11 Written in ink on paper slilp found with item

Dimensions

overall: 1/8 in x 3 1/2 in x 4 in

Description

Object is a wafer etched with an array of small circuits, then placed on an adhesive backing and diced to release the individual ICs. Roughly one-fourth of the ICs have been removed. This and the linked record were found together in a single container.

Category

Component/Semiconductor/other

Credit

Gift of Gordon and Gwen Bell

Lot Number

X1770.2000A-D
 

Related Records

102732895 Wafer, 4 inch, diced