Title
Bonded RISC II chipCatalog Number
102741727Type
Physical objectDescription
The object consists of a silicon die attached to a dip header by very fine bonded wires.Date
Circa 1980sDimensions
overall: 3/8 in x 3 1/4 in x 7/8 inCategory
Component/Semiconductor/microprocessorCredit
Gift of Ralph CampbellLot Number
X7602.2016