Artifact Details

Title

Bonded RISC II chip

Catalog Number

102741727

Type

Physical object

Date

Circa 1980s

Dimensions

overall: 3/8 in x 3 1/4 in x 7/8 in

Description

The object consists of a silicon die attached to a dip header by very fine bonded wires.

Category

Component/Semiconductor/microprocessor

Credit

Gift of Ralph Campbell

Lot Number

X7602.2016