Artifact Details

Title

CPU module

Catalog Number

X1354.97

Type

Physical object

Manufacturer

Trilogy

Place Manufactured

U.S.

Identifying Numbers

Model number Trilogy

Dimensions

A: 3 5/8 x 3 1/2 x 3 1/2 (HWD); B: 3/4 x 9 3/4 x 7 7/8 (HWD); C: 1 1/8 x 5 x 5 1/2 (HWD)

Description

This item comprises three pieces: A: CPU B: Socket (PGA) Assembly C: CPU Removal Tool The module shown here demonstrates an early attempt at Wafer Scale Integration--the packaging of multiple circuit elements (die) on a single silicon wafer.

Category

Component: circuit board / module

Lot Number

X1354.97