Blister-packed chip set for IM6100 development work. Pack includes the following ICs: IM6100 (CPU), IM6101 (PIE), IM6402 (UART), IM6312 (1K x 12 ROM), ICM7213, 3 x IM6561 (256 x 4 RAM). Second anti-static foam carrier contains: 2 x IM6100 (CPU), IM6101 (PIE), IM6102 ICs. This kit allowed circuit designers to devise functioning microprocessor-based systems with a minimum of effort. Parts were included to simplify interfacing and circuit diagrams provided generic solutions to many typical problems.