Artifact Details

Title

Dec Flip chip Modules

Catalog Number

XD213.80

Type

Physical object

Date

1965

Manufacturer

Digital Equipment Corporation (DEC)

Place Manufactured

U.S.

Identifying Numbers

Model number Model R210- B131

Dimensions

170x170mm- 170x50mm

Description

These modules embed DEC's manufacturing philosophy of field replaceable units which can be inserted into a common, automatically-wired backplane. Possibly the most important factor in DEC's ability to manufacture inexpensive minicomputers throughout the 1960s was its adoption of the Garnder-Denver automated wirewrapping machine, a sophisticated device that made the thousands of interconnections required in a computer's backplane assembly rapidly, automatically, and with nearly zero errors. This reliable system of interconnected sockets in turn allowed the simple "Flip-Chip" circuit board to be the building block of a computer, allowing for mass production and ease of maintenance. -- JAC 2/12/2002

Category

Component: circuit board / module

Credit

Gift of Digital Equipment Corporation (DEC)

Lot Number

XD213.80