Wafer - 1.5 in, circa 1967

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  • Details
  • Description
Date Introduced
1967 ca.
Photographer
Richards, Mark
Dimensions
overall: 1/8 in x 1 1/2 in x 1 1/2 in
Copyright Owner
© Mark Richards
Object ID
102662144

Wafer, smallest component dimension: about 10 µ

IC Package, 14 leads, Fairchild Semiconductor, US, Ceramic Dual-inline Package (DIP)