Flip Chip B212 module
This B212 module consists of numerous components on one side of the board. On the same side there is an inspection stamp. The circuit side of the board consists of printed conductors.
Digital Equipment Corporation (DEC)
||Located on the face of the extraction handle.
||Located on the circuit side of the board.
overall: 1/2 in x 2 1/2 in x 5 1/2 in
SAP Collection, Computer History Museum