Computer History Museum

Assortment of plastic and ceramic dual-inline-packages

Packages of ceramic and molded plastic/epoxy dual-inline-packges. Includes example the "Fairpak" -- a flip-chip bonded intergated circuit (in lucite). Printed on the plastic case is "WESTERN GOLD & PLATINUM CO., BELMONT, CALIFORNIA, 94002".

Assortment of plastic and ceramic dual-inline-packages - Image 1

Item Details

Type
Physical Object
Catalogue number
102676924
Other identifying number
S 550 (Other number)
Category
IC
Dimension
7 1/2w x 1 1/4h x 5 1/4l (in)
19.05w x 3.18h x 13.34l (cm)
Acquisition number
X4294.2008