TitleSemiconductor lead frames
Description#32 - Toward the end of the 1960s, some companies were experimenting with multichip array packages, which could act as memory modules. Box #32 of this lot contains many of these modules, which typically housed anywhere from 8 to 12 integrated circuit chips, mounted o n m fine line patterns, mostly in quad pak configurations with through-h61d,mounting into their printed circuit board. The metallization patterns on-these packages pushed the limits of screen printing technology to the point where etched thin film
circuits were often used to achieve super fine-line geometries.
ManufacturerFairchild Semiconductor Corporation
|Other number||32||Donor's key number.|