Artifact Details
Title
IC Package with heat sinkCatalog Number
102688688Type
Physical objectDescription
Object is an IC package with integral heat sink, described by the donor as follows:#76,77 - As power dissipation increased dramatically on semiconductor products
during the 1980s, complex heat sinks were developed, which required
spring-loaded pressurized contact to dissipate all of the heat generated by
the chips. Such dissipation mechanisms are shown in these samples.
Dimensions
overall: 1 in x 2 1/4 in x 2 1/2 inCategory
Component/Semiconductor/ICCredit
Gift of SEMILot Number
X4294.2008