IC Package with heat sink
Object is an IC package with integral heat sink, described by the donor as follows: #76,77 - As power dissipation increased dramatically on semiconductor products during the 1980s, complex heat sinks were developed, which required spring-loaded pressurized contact to dissipate all of the heat generated by the chips. Such dissipation mechanisms are shown in these samples.
Item Details
- Type
- Physical Object
- Catalogue number
- 102688688
- Category
- IC
- Weight
- 1 (lb)
- Dimension
- 2 1/4w x 1h x 2 1/2l (in)
5.72w x 2.54h x 6.35l (cm) - Acquisition number
- X4294.2008