Computer History Museum

IC Package with heat sink

Object is an IC package with integral heat sink, described by the donor as follows: #76,77 - As power dissipation increased dramatically on semiconductor products during the 1980s, complex heat sinks were developed, which required spring-loaded pressurized contact to dissipate all of the heat generated by the chips. Such dissipation mechanisms are shown in these samples.

IC Package with heat sink - Image 1

Item Details

Type
Physical Object
Catalogue number
102688688
Category
IC
Weight
1 (lb)
Dimension
2 1/4w x 1h x 2 1/2l (in)
5.72w x 2.54h x 6.35l (cm)
Acquisition number
X4294.2008