Computer History Museum

Box of high-power packages

Donor wrote, "This collection of high power packages, including beryllium oxide power platforms, along with super-high-density quad paks, mounted on copper pillars, clearly reveals the thermal issue. Even simple plastic 14-lead DIP packages have huge heat sinks emanating from the top and the sides to help dissipate power."

Box of high-power packages - Image 1

Item Details

Type
Physical Object
Catalogue number
102688700
Other identifying number
TDA 1170 7938 (Other number)
87318-04 (Other number)
L 36 7 1P940 (Other number)
64 (Other number)
Category
Other
Weight
1 (lb)
Dimension
4 5/8w x 7/8h x 16l (in)
11.75w x 2.22h (cm)
Acquisition number
X4294.2008