Artifact Details

Description

Donor wrote, "Not to be left out, manufacturers of flexible printed circuit tape began
flooding the market with super-fine-line geometries, executed on reel-to-reel
tape patterns, as shown in this collection from some 40 different
suppliers. The reel-to-reel tape assembly process for packaging chips took a
huge turn upward in the 1970s, when National Semiconductor launched its
TAB (tape automated bonding) program with 3M Corporation, in
developing a fully automated gang bonding process. Samples of this are
shown in this collection."

One sample contains a label "3M Micro interconnecting Systems". Another sample is labeled AUGAT PACTEL PRODUCTS".

Identifying Numbers

Other number

28

Handwritten on sticker on one sample

Dimensions

in box: 1/2 in x 3 1/2 in x 5 1/4 in

Category

Miscellaneous/other

Credit

Gift of SEMI

Lot Number

X4294.2008