TitleIntegrated circuit packages
DescriptionThe donor's description of this object is as follows:
"There are a series of small 3-lead transistor packages and a collection of seven flatpaks designed with ceramic substrates attached to metal stamped leadframes. Also included is an early version of one dual inline package (DIP) prior to lead separation and encapsulation."
There are 14 pieces in this collection and accession number.
|Other number||9||Key number provided by donor on a label on the box|