Title
ITPD interconnect technology process developmentCatalog Number
102717822Type
DocumentDescription
From the original program:This talk will cover activities of Andover's Intervonnect Technology and Process Development (ITPD) group fomr the points of view:
History, including ITPD contribution to surface Mount technology, including Unique Development in Tape Automated Bonding (TAB) Process.
Present, including prototype TAB operations in APO, a TAB-based VAX test vehicle design and assembly (CSTAR), and High Performance Tape Pack (HPTP) process development.
Future, uncluding Pilot Line partnership plans, and A/D work in areas of IC-array interconnect and fiber-optics.
The emphasis will be on 'real' assembly technology issues as opposed to organizational charts and project plans.
Date
1988-10-25Contributor
Hallowell, Dave, Speaker |
Publisher
Digital Equipment Corporation (DEC)Category
Presentation MaterialCollection Title
Digital Equipment Corporation recordsSeries Title
Moving images: DEC libraries' A/V holdingsCredit
Gift of Hewlett-Packard CompanyLot Number
X2675.2004Related Records
102717821 | ITPD interconnect technology process development |