TitleDuffek patent notebook (#191)
DescriptionDescribes projects related to the deposition of a wide variety of materials on silicon and semiconductor packaging components, including the production of oxide films on silicon by an ambient temperature process of anodic oxidization. Specific entries include; the formal project plan for anodic oxidization written by W. Waring (p. 4); disclosure of process for preparing magnetic films on silicon (p. 10); electro-less gold plating process (p. 18); CDC gate circuit project on a ceramic substrate – many samples of substrate material taped onto the pages of the book (pp. 22-42); pattern copper plating onto silicon (p. 45); plating wafers for upside-down mounting (flip-chip) (p. 56).
AuthorDuffek, Edward F.
Biographical NotesEdward F. Duffek received a B.S. (1952), M.S. (1956) and a Ph.D. (1957) in physical chemistry from Carnegie Institute of Technology in Pittsburgh, Pennsylvania. From 1957 to 1962 he was associated with the Metallurgical Department of Stanford Research Institute. He joined Fairchild circa 1962 as a Member of Technical Staff where he served as Group Leader in Electrochemistry working on electrochemistry of semiconductors, electroplating materials and process development until circa 1970.
ExtentApproximately 104 dated entries over 127 pages.
Dimensions12 x 10 inches
Collection TitleFairchild Semiconductor notebooks and technical papers
PublicationsThe author contributed to the following R&D Technical Reports (TR) and papers in professional publications during his service at Fairchild:
TR88 Electropolishing of silicon (1962-11-23).
TR109 Electrode reactions and mechanism of silicon anodization in N methylacetamide (1963-04-05).
TR123 Evaluation of silicone varnish as an insulating film material (1963-06-26).
TR125 Developments in electroless plating processes (1963-07-12).
TR176 The anodic oxidation of silicon in ethylene glycol solutions (1964-05-28).
TR182 Photoresist oxide etch solutions (1963-07-15).
TR209 Applications of various electroless plating processes (1966-04-26).
TR223 Hole plating of printed circuit boards - A feasibility Study (1966-07-19).
TR373 Electroplating the new generation of microelectronic devices (1968-11-08).
TR380 Fine line patterning of metallized ceramics (1969-01-31).
Benjamini, E. A. and Duffek, E. F. Electrode assembly for anodization of semiconductors. Review of Scientific Instruments, vol. 35, iss. 2 (1964): 237-238
Duffek, E. F. Fine Line Patterning of Metalized Ceramics. Report prepared for the Defense Technical Information Center (1970).
*Duffek, E.F. Plating of semiconductor & electronic devices. Plating Magazine, (1974-09)
*Duffek, E.F., Benjamini, E.A. and Mylroie, C. The anodic oxidation of silicon in ethylene glycol solutions. Electrochemical Technology, vol. 3 (1965): 75-80.
*This paper is included in a three volume bound set of “Fairchild Research Published Technical Papers” assembled by Bruce Deal in 1988 (copy in the CHM Fairchild collection).