TitleDumesnil patent notebook (#1117)
DescriptionThis volume continues the work on packaging materials and methods described in (370). Specific entries include: a review of work to date on low melting point, low expansion glass for ceramic seals (pp. 1-13); disclosure on “method of making multilayer ceramic substrates” (pp. 14-16); disclosure on passivation of phosphorus rich silicon dioxide layers (pp. 20-22); photos of two-layer substrate with eight 16-bit bipolar RAMs (p. 25); disclosure on low-melting point, low-expansion glass compositions (pp. 27-32); search for glass filter for photosensor (pp.57-58).
AuthorDumesnil, Maurice E.
Biographical NotesMaurice E. Dumesnil worked for DuPont, located in Wilmington, Delaware, in 1960. He joined Fairchild circa 1961 where he performed research on deposition of oxide on silicon and on glass materials used in the sealing of semiconductor device packages. In 1966 he was a Member Technical Staff in the Materials and Processes Department reporting to H. Sello and in 1968 he was in the Dielectric Films section reporting to B. Deal. He joined Technology Glass Corporation, Sunnyvale, California, in the 1970s and in the late 1980s was with VLSI Packaging Materials, Inc. Sunnyvale, California.
ExtentApproximately 25 dated entries over 82 pages.
Dimensions12 x 10 inches
PatentsThe author is named as inventor on at least 13 U.S patents, including 3 patents assigned to Fairchild:
U.S. patent 3432405, “Selective masking method of silicon during anodization.” Filed 1966-05-16. Issued 1969-03-11.
U.S. patent 3408212, “Low melting oxide glass.” Filed 1965-06-04. Issued 1968-10-29.
U.S. patent 3650778, “Low-expansion, low-melting zinc phosphovanadate glass compositions.” Filed 1969-10-29. Issued 1972-03-21.
Collection TitleFairchild Semiconductor notebooks and technical papers
PublicationsThe author contributed to the following R&D Technical Reports (TR) and papers in professional publications during his service at Fairchild:
TR65 Semiconductor glasses [1962-02-09].
TR71 Considerations on a high voltage planar thermoelectric converter [1962-04-27].
TR94 Microelectronic component interconnections and packaging - part I [1962-12-28].
TR124 Chromium-silicon contacts [1963-06-26].
TR167 Microelectronic component interconnections and packaging - part II [1964-04-03].
TR179 Aluminum-silicon resistance as a function of silicon resistivity, alloying cycle and contact geometry, case 1: p-silicon (boron doped) [1964-05-28].
TR225 Space charge polarization in glass films [1965-07-20].
TR276 Fused glass films on silicon devices [1967-01-0-15].
TR313 The Vitrox process: Fairchild #10 and #74 glass synthesis, comminution and fusion on silicon devices [1967-10-10].
Dumesnil, M. and Schroeder, J., A large-scale integration hybrid substrate. 1969 IEEE International Solid-State Circuits Conference: Digest of Technical Papers, vol. XII, (1969): 66-67.
Snow, E. H. and Dumesnil, M. E., Space-charge polarization in glass films, Journal of Applied Physics, vol. 37, iss. 5 (1966): 2123-2131.