TitleForbes patent notebook (#317)
DescriptionDescribes work on design and selection of package materials (ceramic, glass, metal) for holding IC chips. Covers analysis of contamination and hermeticity problems of the Cerpak (ceramic flat pack).Visit reports to TI and Signetics to evaluate packages and competitive analysis of GMe and Sylvania packages. Numerous drawing, package parts and photos taped onto the pages. Development notes on the Fairpak solder-bump bonded die package.
AuthorForbes, Don (Donald) W. A.
Biographical NotesDonald (Don) W. A. Forbes was a draughtsman and mechanical engineer who moved with Rex Rice and others from IBM Research Labs in Poughkeepsie, New York, to form the Fairchild Digital Systems Research Department circa 1963. In 1964 - 1965 he created the engineering drawings and contributed to the design of the ceramic dual-inline-package (DIP). See also entries on Rex Rice and Bryant Rogers. The DIP has been described as the most enduring IC package. The first devices were 14-lead ceramic devices with two rows of pins on 100 mil centers providing greater design freedom and an early de facto industry standard for package pin outs and footprints. A 1966 organization chart shows Forbes as head of the Packaging Development Section reporting to W. Steffe, Manager of the Device Development Department.
ExtentApproximately 87 dated entries over 138 pages.
Dimensions12 x 10 inches
Collection TitleFairchild Semiconductor notebooks and technical papers
PublicationsThe author contributed to the following R&D Technical Reports (TR) and papers in professional publications during his service at Fairchild:
TR194 The evolution of Fairchild flat packs (1964-12-07).
TR229 Fine particle dispersion modification of solder glasses - effects on mechanical strength (1965-10-25).
Forbes, D.W.A. The impact of semiconductors on ceramics. Ceramic Age (1966-07).