This volume describes a concept for assembling die in an hermetic carrier that permits testing prior to final mounting in a more expensive DIP package, and a concept for a TO5 type package carrier for economic assembly.
Rogers, Buck (Bryant) C.
Bryant (Buck) C. Rogers joined Fairchild Semiconductor in Mountain View, California, from Photonics in Goleta, California, in the early 1960s. While in charge of the packaging department at Fairchild in 1965 he co-invented the 14-pin ceramic dual-in-line package (DIP) with Rex Rice and Don Forbes (see their notebook entries). Later extended to multiple lead counts and materials, the DIP outline was the predominant form of integrated circuit packaging in the late 1960s and 1970s. This book was issued to the author in the role of Plant Manager for the San Diego IC packaging operation in 1970. The business was purchased and operated as Diacon, Inc. where Rogers continued to work and file patents into the late 1970s.
2 dated entries over 2 pages.
12 x 10 inches
Three patents identified. None issued to Fairchild.
Fairchild Semiconductor notebooks and technical papers