Flip chip cntl and status regs module
This module consists of integrated circuits, capacitors and doides. There are circuits on both sides. There are several inspection stamps on side 1.
Digital Equipment Corporation (DEC)
||Stamped into plastic of handle on side 2.
||Written in black on handle on top edge on side 1.
||Written in solder on side 2 near left edge.
||Printed in white on handle and solded on side 2 near handle.
overall: 8 7/8 in x 5 1/4 in x 1/2 in
Gift of Hewlett-Packard Company