This object is a DIP wirewrap prototype board with 6949 wires wrapped on the wire-wrap pins; there are no components mounted on the board. Three 96-pin plugs line the back of the board and are used for I/O connections, and two 40-pin and two 50-pin double row header connectors are arranged along the front edge and are not connected to anything. There is an order tag attached by a string to the board listing the customer as 'MIT' that contains various order information and inspection stamps. This board was part of the MIT project led by Professor Arvind to build the Monsoon data flow multiprocessor.
Manufacturer
Augat, Inc.
Identifying Numbers
Other number
062687
Stamped in black ink on the long edge of the board.
Part number
324352
Stamped in black ink on the long edge of the board.
Part number
X8136-HPG57-2TG
Printed in white ink on the long edge of the component side; this number is labeled 'part number' on a tag attached to the board.