Stamped in black ink on the short edge of the board.
Part number
8136-HPG24
Printed in white ink on the short edge of the board; this is Augat's part number.
Dimensions
overall: 7/8 in x 14 7/8 in x 11 5/8 in
Description
This object is a DIP wirewrap prototype board, about two-thirds of which is populated with 14- to 24-pin DIP packages and a small number of capacitors, resistors, and jumpers. Two extraction handles are mounted at the ends of the front edge. Blue, red, white, and black wires are used on the wire-wrap pins. Three 96-pin plugs line the back of the board, and two 40-pin and two 50-pin double row header connectors are arranged along the front edge. Only the header pins are used as input/output connections. This board was part of the MIT project led by Professor Arvind to build the Monsoon data flow multiprocessor.
