Title
Bonded RISC II chip
Catalog Number
102741727
Type
Physical object
Description
The object consists of a silicon die attached to a dip header by very fine bonded wires.
Date
Circa 1980s
Dimensions
overall: 3/8 in x 3 1/4 in x 7/8 in
Category
Component/Semiconductor/microprocessor
Credit
Gift of Ralph Campbell