Directly from the program:
"This seminar introduces Surface Mount Technology and provides an overview of DEC's internal effotrts at the Process and Design Support group in Andover. The discussion focuses on the design, manufacturing and assembly of surface mount modules. Over the next few years, Surface Mount Technology, or SMT, will be avolving into the next generation of printed wiring boards and modules at an extremely fast pace. The reason is that the Dual-In-Line package (DIP), which has been the dominat IC package is unable to meet the high performance requirements for very large integration (VLSI). The new technology, combining surface mount with recent advances in printed wiring boards, has significant cost and performance packaging benefits. This discussion establishes guidelines for the design engineer."