Flip Chip B360 module
Digital Equipment Corporation (DEC)
||Printed on handle
overall: 1/2 in x 2 3/8 in x 5 1/2 in
On the solder side is etched "DELAY WITH PA B360". On the component side is one round black inspection stamp. A large black component is printed "ESC TRIMLINE NO. 73-63".
SAP Collection, Computer History Museum