Artifact Details

Title

IC Package with heat sink

Catalog Number

102688688

Type

Physical object

Dimensions

overall: 1 in x 2 1/4 in x 2 1/2 in

Description

Object is an IC package with integral heat sink, described by the donor as follows:
#76,77 - As power dissipation increased dramatically on semiconductor products
during the 1980s, complex heat sinks were developed, which required
spring-loaded pressurized contact to dissipate all of the heat generated by
the chips. Such dissipation mechanisms are shown in these samples.

Category

Component/Semiconductor/IC

Credit

Gift of SEMI

Lot Number

X4294.2008