TitleIC Package with heat sink
Dimensionsoverall: 1 in x 2 1/4 in x 2 1/2 in
DescriptionObject is an IC package with integral heat sink, described by the donor as follows:
#76,77 - As power dissipation increased dramatically on semiconductor products
during the 1980s, complex heat sinks were developed, which required
spring-loaded pressurized contact to dissipate all of the heat generated by
the chips. Such dissipation mechanisms are shown in these samples.