Stamped into the back of the metal extraction handle
Stamped on the white label on the front
Printed on the solder side of the board in the extraction end corner
overall: 1/2 in x 16 1/2 in x 8 3/4 in
This module consists of many DIP intergrated circuits, resistors, capacitors, diodes, and transistors. On the component side there is a May 13 1970 date stamp. There are also three inspection stamps below the date. "+ Flip Chip" is printed in the center of the component side of the board.