Artifact Details

Title

Integrated circuit development remnants

Catalog Number

102730135

Type

Physical object

Dimensions

overall: 1 in x 2 1/2 in x 2 1/2 in

Description

Objects consist of a two-inch wafer broken in half, an envelope of integrated circuits in bulk, one package of integrated circuits sitting properly in its original packaging, and one package of integrated circuits where the ICs have fallen out of the original plastic holder and are laying in bulk in the plastic envelope.

Category

Component/Semiconductor/other

Credit

Gift of Carver Mead

Lot Number

X5294.2009
 

Related Records

102730133 Circuit masks